发明名称 |
Vertical conduction power electronic device package and corresponding assembling method |
摘要 |
A vertical conduction power electronic device package (1) and corresponding assembly method comprising at least a metal frame (2) suitable to house at least a plate or first semiconductor die (16,35) having at least a first (17) and a second conduction terminal (18) on respective opposed sides of the first die (16,35). The first conduction terminal (17) being in contact with said metal frame (2) and comprising at least an intermediate frame (23,24) arranged in contact with said second conduction terminal (18). <IMAGE> |
申请公布号 |
EP1603157(A1) |
申请公布日期 |
2005.12.07 |
申请号 |
EP20040425399 |
申请日期 |
2004.05.31 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
FERRARA, MAURIZIO MARIA;MAGRI', ANGELO;MINOTTI, AGATINO |
分类号 |
H01L23/31;H01L23/495;H01L23/52 |
主分类号 |
H01L23/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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