Planarisierungsvorrichtung

摘要

A polishing stage (22) is mounted on a body (12) provided with a rough grinding stage (18) and a fine grinding stage (20) so that a wafer (28) can be roughly ground, finely ground and polished in one planarization apparatus (10). The planarization apparatus (10) also has a cleaning stage (23) for cleaning a polishing pad (56) of the polishing stage (22) to thereby clean the dirty cleaning pad (56). The planarization apparatus (10) is also provided with an etching unit (150, 190) to thereby perform a sequence of planarization from the rough grinding to the etching.