发明名称 |
Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer |
摘要 |
A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. The bases are joined together by an adhesive layer. A fluid passage is formed in a joining interface between the bases.
|
申请公布号 |
US2005260938(A1) |
申请公布日期 |
2005.11.24 |
申请号 |
US20050192846 |
申请日期 |
2005.07.28 |
申请人 |
|
发明人 |
OKUDA YUJI;JIMBO NAOYUKI;MAJIMA KAZUTAKA;TSUJI MASAHIRO;TAKAGI HIDEKI;ISHIKAWA SHIGEHARU;YASUDA HIROYUKI |
分类号 |
B24B1/00;B24B37/015;B24B37/04;B24B37/12;B24B37/14;B24B37/16;B24B41/047;B24B49/14;(IPC1-7):B24B1/00 |
主分类号 |
B24B1/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|