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发明名称
SLURRY FOR CMP AND METHODS OF POLISHING SUBSTRATES USING THE SAME
摘要
申请公布号
KR20050110441(A)
申请公布日期
2005.11.23
申请号
KR20040035455
申请日期
2004.05.19
申请人
K.C. TECH CO., LTD.;HANYANG HAK WON CO., LTD.
发明人
KIM, DAE HYUNG;HONG, SEOK MIN;JEON, JAE HYUN;KIM, HO SEONG;PARK, HYUN SOO;PAIK, UN GYU;PARK, JEA GUN;KIM, YONG KUK
分类号
H01L21/304;(IPC1-7):H01L21/304
主分类号
H01L21/304
代理机构
代理人
主权项
地址
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