| 摘要 |
An electronic module and a method for manufacturing an electronic module, in which an installation base is used, which includes an insulating-material layer ( 1 ) and a conductive layer on the surface of the insulating-material layer. The conductive layer also covers the installation cavity of a component ( 6 ). The component ( 6 ) is set in the installation cavity, in such a way that the contact zones face towards the conductive layer and electrical contacts are formed between the contact zones of the component ( 6 ) and the conductive layer. After this, conductive patterns ( 14 ) are formed from the conductive layer, to which the to which the component ( 6 ) is attached. |
