发明名称 Transition between asymmetric stripline and microstrip in cavity
摘要 The present invention relates to a multilayer printed circuit board arrangement which results in better matching between a stripline (9) and a microstrip (4) in a cavity (6). The solution comprises the use of an asymmetric stripline (9) where the electric field is tied primarily to the lower earth plane (10). This results in good matching at the transition to the microstrip (4), whose field is tied to the lower earth plane (10).
申请公布号 IL146909(A) 申请公布日期 2005.11.20
申请号 IL20000146909 申请日期 2000.06.13
申请人 TELEFONAKTIEBOLAGET L M ERICSSON 发明人
分类号 H05K3/46;H01L23/12;H01L23/64;H01L23/66;H01P5/08;H05K1/00;H05K1/02;H05K1/18 主分类号 H05K3/46
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