发明名称 |
POSITIVE RESIST MATERIAL AND PATTERN FORMING PROCESS USING THE SAME |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive resist material having a high sensitivity and a high resolution in exposure with a high energy line and ensuring a minimal line edge roughness and little residue after development. <P>SOLUTION: The positive resist material such as a chemically amplified positive resist material which is suitable for use particularly as a fine pattern forming material for manufacture of VLSI or in production of a photomask pattern is obtained by using a resist material containing a high molecular compound having repeating units of formulae (1a), (2a) and (1b). <P>COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005321765(A) |
申请公布日期 |
2005.11.17 |
申请号 |
JP20050107100 |
申请日期 |
2005.04.04 |
申请人 |
SHIN ETSU CHEM CO LTD |
发明人 |
HATAKEYAMA JUN;KANEKO TATSUSHI |
分类号 |
G03F7/039;G03F7/004;H01L21/027 |
主分类号 |
G03F7/039 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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