发明名称 POSITIVE RESIST MATERIAL AND PATTERN FORMING PROCESS USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a positive resist material having a high sensitivity and a high resolution in exposure with a high energy line and ensuring a minimal line edge roughness and little residue after development. <P>SOLUTION: The positive resist material such as a chemically amplified positive resist material which is suitable for use particularly as a fine pattern forming material for manufacture of VLSI or in production of a photomask pattern is obtained by using a resist material containing a high molecular compound having repeating units of formulae (1a), (2a) and (1b). <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005321765(A) 申请公布日期 2005.11.17
申请号 JP20050107100 申请日期 2005.04.04
申请人 SHIN ETSU CHEM CO LTD 发明人 HATAKEYAMA JUN;KANEKO TATSUSHI
分类号 G03F7/039;G03F7/004;H01L21/027 主分类号 G03F7/039
代理机构 代理人
主权项
地址