发明名称 EQUIPMENT AND METHOD FOR VAPOR PHASE EPITAXY
摘要 PROBLEM TO BE SOLVED: To provide vapor phase epitaxy equipment which equalizes temperature distribution of gas in a perimeter region of a processed substrate and reduces variation of composition and thickness of a thin film formed on the processed substrate. SOLUTION: In the vapor phase epitaxy equipment 20 which forms the thin film on the processed substrate 21 by using gas as material, a heating means 37 is arranged in a reaction tube 23 which means heats the gas introduced in the direction which meets in a depositing surface of the processed substrate 21. A control means 30 with which the heating means 37 is equipped performs motion control of a heater power supply 28 and a drive means 29 in response to detection output of a temperature sensor 26 which measures temperature at a predetermined source position in the reaction tube 23, adjusts source position and calorific value of a gas heating heater 27 individually, and heats introduced gas. The gas heated at suitable temperature in a suitable source position in the reaction tube 23 forms uniform temperature distribution at a part in the vicinity of the processed substrate 21. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005322837(A) 申请公布日期 2005.11.17
申请号 JP20040141195 申请日期 2004.05.11
申请人 SHARP CORP 发明人 TANAKA NOBUMASA
分类号 C23C16/52;H01L21/205;(IPC1-7):H01L21/205 主分类号 C23C16/52
代理机构 代理人
主权项
地址