发明名称 HEAT PIPE JOINT, COOLING DEVICE, ELECTRONIC APPLIANCE AND METHOD OF MANUFACTURING HEAT PIPE JOINT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat pipe joint capable of achieving air-tightness while keeping flexibility. <P>SOLUTION: This heat pipe joint 1A is formed by cylindrically winding a sheet-shaped laminate film 2 composed of a resin layer and a metallic layer. The heat pipe joint 1A comprises a first joint part 5 joined with an outer periphery of an end part of a first heat pipe 3, and a second joint part 6 joined with an outer periphery of an end part of the second heat pipe 4. Further a third joint part 7 is formed to overlap and join end parts of the laminate film 2 in the circumferential direction. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p>
申请公布号 JP2005321143(A) 申请公布日期 2005.11.17
申请号 JP20040139133 申请日期 2004.05.07
申请人 SONY CORP 发明人 AMANO KOTARO
分类号 F28D15/02;H01L23/427;H05K7/20;(IPC1-7):F28D15/02 主分类号 F28D15/02
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