发明名称 MATERIAL AND METHOD FOR MANUFACTURING BOARD STRUCTURE FOR DISPLAY PANEL
摘要 PROBLEM TO BE SOLVED: To reduce the number of calcinations to be required when electrodes and a dielectric layer are formed. SOLUTION: Materials mentioned here are for manufacturing a board structure for display panels having at least electrodes and a dielectric layer on a glass substrate. The materials are composed of an electrode material comprising conductive particles and a binder resin whose thermal decomposition temperature is T1, and a dielectric material comprising a binder resin whose thermal decomposition temperature is T2 and low melting glass whose glass softening point is Tb, and are composed of a combination of the electrode material and the dielectric material whose decomposition temperatures T1 and T2 and softening point Tb have a relation of T2<T1<Tb. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005322444(A) 申请公布日期 2005.11.17
申请号 JP20040137691 申请日期 2004.05.06
申请人 HITACHI LTD 发明人 TOYODA OSAMU;INOUE KAZUNORI
分类号 H01J9/02;C03B1/00;C03C17/34;H01J9/24;H01J11/12;H01J11/22;H01J11/24;H01J11/26;H01J11/34;H01J11/36;H01J11/38;H01J17/02;(IPC1-7):H01J11/02 主分类号 H01J9/02
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