发明名称 SEALING PLATE
摘要 PROBLEM TO BE SOLVED: To increase the connection numbers of lead wires capable of connecting a metal terminal 4 to a lead wire connecting part 8 in a sealing plate formed by embedding the metal terminal 4 in a sealing plate main part made of a polymer material closing an opening part of a pressure container such as a battery or a capacitor so as to pass through the sealing plate main part. SOLUTION: A surface area widening part 7 widening the surface area of a lead wire connecting part 8 is installed in the lead wire connecting part 8 in the metal terminal 4 and the surface area of the lead wire connecting part 8 is made wider than the cross section of an embedding object body main part 5 in the metal terminal 4. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005322415(A) 申请公布日期 2005.11.17
申请号 JP20020128707 申请日期 2002.04.30
申请人 NOK CORP;OTALITO KK 发明人 AGUI KENICHI;HAYASHI MITSUHIKO;YONEKURA KATSUMI
分类号 H01G9/008;H01G9/10;H01G9/12;H01M2/06;H01M2/08;H01M2/30;(IPC1-7):H01M2/06 主分类号 H01G9/008
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