发明名称 |
MANUFACTURING TOOL FOR WAFER LEVEL PACKAGE AND METHOD OF PLACING DICE |
摘要 |
A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurality of dice; forming an adhesive material on a second base; adhering the plurality of dice on the adhesive material of the second base; and stripping the plurality of dice from the elastic material in a second condition. |
申请公布号 |
KR20050107720(A) |
申请公布日期 |
2005.11.15 |
申请号 |
KR20040050088 |
申请日期 |
2004.06.30 |
申请人 |
ADVANCED CHIP ENGINEERING TECHNOLOGY, INC. |
发明人 |
YANG WENKUN;YANG WENPIN;CHEN SHIHLI |
分类号 |
H01L21/60;B23P19/00;B44C1/00;C09J1/00;H01L21/00;H01L21/44;H01L21/50;H01L21/58;H01L21/68;H01L21/82;H01L23/31;(IPC1-7):H01L21/82 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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