发明名称 ELECTRICALLY INSULATING RESIN COMPOSITION, AND SHEET-LIKE UNCURED PRODUCT, UNCURED LAMINATE FOR CIRCUIT BOARD AND CURED LAMINATE FOR CIRCUIT BOARD OBTAINED USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an electrically insulating resin composition which exhibits excellent flexibility and adhesion to a substrate, has high heat resistance and humidity resistance, can bear a high-temperature treatment at the time of soldering and forms an electrically insulating layer stably serviceable for a long period of time even under severe environments of high temperatures and vibration in an automobile. SOLUTION: The electrically insulating resin composition is caused to contain at least a rubbery polymer (A) comprised of a copolymer of a vinyl aromatic compound with a conjugated diene compound, a polymerizable monomer (B) bearing at least one reactive double bond at its end and an oligomer (C) having a cyclic structure and a reactive unsaturated bond in the molecule, and is compounded so that the hardness D of the organic component contained therein is at most 75 after cured. Thus, the electrically insulating layer endowed with excellent flexibility, adhesion, humidity resistance and heat deterioration resistance is formed. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005314554(A) 申请公布日期 2005.11.10
申请号 JP20040134179 申请日期 2004.04.28
申请人 NHK SPRING CO LTD 发明人 KOMURASAKI HIDETO;ITO TOMOYUKI;KOYAMA NOBUAKI;KUSAKAWA KOICHI
分类号 C08J5/24;B32B15/06;B32B15/08;C08F2/44;C08F291/00;H01B3/30;H01B17/60;H05K1/03;(IPC1-7):C08F291/00 主分类号 C08J5/24
代理机构 代理人
主权项
地址