| 摘要 |
Heater module, and semiconductor manufacturing equipment in which the heater module is utilized, for raising the cooling speed of a post-heating heater markedly more than conventional, and that can contribute toward bettering and improving productivity, without accompanying scaling-up of and cost increases in the semiconductor manufacturing equipment. The heater module is furnished with heater part 1 a for controlled heating of a wafer placed on its top face, and block part 3 a provided to be shiftable relative to said heater part, for varying heat capacity in total with heater part 1 a by abutting on or separating from the reverse surface of heater part 1 a. By having the heat capacity of block part 3 a be 20% or more of the total heat capacity of heater part 1 a and block part 3 a, the heater cooling speed can be made 10° C./min or more. |
