| 摘要 |
PROBLEM TO BE SOLVED: To prepare an adhesive film for a semiconductor, capable of bonding a semiconductor element with a semiconductor mounting support member such as a leadframe and organic substrates exemplified by a bismaleimide-triazine substrate and a polyimide substrate and having excellent bonding properties at a low temperature and adhesion at a high temperature, and to provide a semiconductor device using the same film. SOLUTION: The adhesive film for the semiconductor is formed by using a resin composition containing an acrylic copolymer, a first thermosetting resin and a second thermosetting resin. COPYRIGHT: (C)2006,JPO&NCIPI
|
