| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the semiconductor device of a thin, high-density mounting structure which can avoid breakdown of an electrical connection between a main board and a module board and can prevent improper electric connection, even when the main board or the module board is warped or dropped and impacted, and to provide a method for manufacturing the semiconductor device, and a portable electronic device having the semiconductor device built therein. <P>SOLUTION: In the semiconductor device, a module board 3, having an electronic component 9 and electronic component groups 17, 18 mounted thereon, is mounted on a main board 2. In the semiconductor device, at least one of surfaces of the electronic component groups 17, 18 mounted on the module board 3 is bonded with an adhesive 8 and fixed to the surface of the main board 2. An external terminal 5 as an electrical connection point of the module board 3 and an external terminal 4 as an electrical connection point of the main board 2 are electrically connected together by a connection terminal 1 having resilience. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
