发明名称 |
INSULATION SHEET, INSULATION SHEET WITH BASE MATERIAL, AND MULTILAYER PRINTED CIRCUIT BOARD |
摘要 |
PROBLEM TO BE SOLVED: To provide an insulation sheet, an insulation sheet with a base material and a multilayer printed circuit board using the insulation sheet capable of forming a conductive circuit with excellent smoothness and adhesiveness to an insulation resin layer. SOLUTION: The insulation sheet is formed of a resin composition containing hardening resin and an inorganic filling material and has a first exothermic peak and a second exothermic peak located at a higher temperature than the first peak. The multilayer printed circuit board uses the insulation sheet. COPYRIGHT: (C)2006,JPO&NCIPI |
申请公布号 |
JP2005285540(A) |
申请公布日期 |
2005.10.13 |
申请号 |
JP20040097528 |
申请日期 |
2004.03.30 |
申请人 |
SUMITOMO BAKELITE CO LTD |
发明人 |
HOZUMI TAKESHI;ARAI MASATAKA;BABA TAKAYUKI;WAKABAYASHI HIROAKI |
分类号 |
C08J5/18;B32B27/38;B32B27/40;C08K3/00;C08L101/00;H01B3/00;H05K3/46;(IPC1-7):H01B3/00 |
主分类号 |
C08J5/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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