| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board with through-conductors having a high connection reliability, and to provide its manufacturing method. SOLUTION: The wiring board comprises a core substrate A containing at least a resin, an insulation layer 1 formed at least on one principal plane of the core substrate A, the through-conductors 13 extended through the insulation layer 1, and an interconnection layer 11 formed on a principal plane of either the core substrate A or the insulation layer 1. The through-conductors 13 are formed in a drum-like shape. COPYRIGHT: (C)2006,JPO&NCIPI |
