| 摘要 |
According to one embodiment of the invention, a method includes providing a semiconductor chip, providing a substrate, forming a plurality of cantilevered springs outwardly from either the semiconductor chip or the substrate, engaging the cantilevered springs with respective contact pads on either the semiconductor chip or the substrate with a fixture, encapsulating the semiconductor chip and cantilevered springs with a molding, and curing the molding.
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