Method for manufacturing leadless semiconductor packages

摘要

A method for manufacturing a plurality of leadless semiconductor packages is disclosed. A provided metal carrier has a plurality of packaging units with contact pads and a plurality of separating streets between the packaging units. A plurality of chips are disposed on the corresponding packaging units of the metal carrier and are electrically connected to the contact pads. A plurality of encapsulants are formed on the corresponding packaging units to encapsulate the chips but exposing the separating streets. After the metal carrier is etched away, the encapsulants connected by mold runner bars can be easily separated without sawing or punching.