| 发明名称 |
Lower profile flexible substrate package for electronic components |
| 摘要 |
Buildup layers may be formed over a flexible substrate. A suitable cavity may be formed in the buildup layers and a silicon die may be positioned over the flexible substrate on a die attach formed within the cavity. As a result, a lower profile flexible substrate package is possible.
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| 申请公布号 |
US2005214978(A1) |
申请公布日期 |
2005.09.29 |
| 申请号 |
US20040807830 |
申请日期 |
2004.03.24 |
| 申请人 |
|
发明人 |
TAGGART BRIAN;NICKERSON ROBERT M.;SPREITZER RONALD I. |
| 分类号 |
H01L21/20;H01L23/498;(IPC1-7):H01L21/20 |
主分类号 |
H01L21/20 |
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代理人 |
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