| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wiring board, which allows various devices, such as semiconductor devices, to be mounted with high density, the promotion of high-speed wiring and high-density fine wiring to be easy, and reliability to be excellent, a semiconductor package using the same, and a manufacturing method of the same. <P>SOLUTION: A base insulating layer 7 is provided in the wiring substrate 13. The thickness of the base insulating layer 7 is in the range from 3 to 100μm. Breaking strength when temperature is 23°C is 80 MPa or more. Elastic modulus when temperature is 150°C is 2.3 GPa or more. Moreover, a ratio (a/b) is made to be≤2.5, where a in MPa is the breaking strength when temperature is -65°C, and b in MPa is the breaking strength when temperature is 150°C, and the breaking strength a and b, and the elastics modulus c and d are set so as to fill an inequality represented by the absolute value of (c/d-a/b)≤0.8, where c in GPa is the elastic modulus when temperature is -65°C, and d in GPa is the elastic modulus when temperature is 150°C. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
