| 摘要 |
PROBLEM TO BE SOLVED: To facilitate manufacturing an optical transmission element and realize an economical packaging. SOLUTION: The module comprises: an optical transmission element 1 emitting or receiving light; a packaging substrate 3 packaging the optical transmission element 1; a through hole 8, transmitting the emission of the optical transmission element 1 or the incident light to the optical transmission element 1, which is prepared at a location facing the optical transmission element 1 packaged on the packaging substrate 3; and an optical image forming element 7. The optical transmission element 1 arranges a light emitting portion or a light receiving portion and an electrode 5 bonding an electrical wiring 4 of the packaging substrate 3 in vamp bonding on the same side surface of the optical transmission element 1. This facilitates manufacturing the optical transmission element 1, and since the optical transmission element 1 and the packaging substrate 3 are positioned together in high accuracy only by bonding them in vamp bonding such as one time flip chip or the like because the vamp bonding has self alighnment effect, high accurate packaging is not necessary, therefore, the economical packaging is realized. COPYRIGHT: (C)2005,JPO&NCIPI
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