| 摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic processing apparatus where an electrically conductive material provided on the surface of a substrate can be flatly processed, and further, depositions deposited on the surface of the object to be processed such as a substrate can be subjected to removing (washing) while, e.g., obviating CMP (Chemical Mechanical Polishing) or reducing the load in the CMP treatment as possible. SOLUTION: The electrolytic processing apparatus is equipped with: an electrode part 46 provided with an electrode member 92 containing an electrode 86 and an ion exchanger 90 covering the surface of the electrode 86; a holding part for bringing the object to be processed into contact with the ion exchanger 90 in the electrode member 92 or holding the object to be processed thereto freely proximately; and a power source connected to an electrode 86 of the electrode member 92 in the electrode part 46, and at least an edge part in the face confronted with the object to be processed in the electrode 86 is provided with a roundness (chamfered part 102). COPYRIGHT: (C)2005,JPO&NCIPI
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