Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same,申请号US20040009246-传众专利搜索

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发明名称	Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same
摘要	The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film wherein a shrinkage release film is inserted between an adhesive film for dicing a wafer and a die adhesive film so that the die adhesive film and a die can be easily separated from the adhesive film for dicing a wafer when picking up a semiconductor die, and a method of manufacturing a semiconductor package using the same.
申请公布号	US2005215032(A1)	申请公布日期	2005.09.29
申请号	US20040009246	申请日期	2004.12.10
申请人		发明人	SEO JOON M.;MOON HYUK S.;HAN CHEOL J.;LEE JONG G.;WI KYUNG T.
分类号	C09J7/02;C09J5/00;C09J7/00;H01L21/301;H01L21/304;H01L21/58;H01L21/68;H01L21/78;(IPC1-7):H01L21/78	主分类号	C09J7/02
代理机构		代理人
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