| 摘要 |
<p>A surface acoustic wave device arranged such that pyroelectricity of a piezoelectric substrate is not revived, and a process for fabricating that device. The piezoelectric substrate (12) of a surface acoustic wave element (10) being contained in a package (22) has a resistivity of 1.0x10<7>-1.0x10<13> ohm.cm. At least one of a solder material (26) being used at the electrical joint between pads (15a, 15b, 15c, 16a, 16b, 16c) and an external electrode, and a sealing material (28) being used for sealing between the package (22) and a cap (23) has a melting point of 300°C or below.</p> |
