A flux formulation without a surfactant for use in the assembly of electroni c circuit boards as a no-clean formulation. The formulation comprises a flux solution having a fluxing agent consisting essentially of o ne or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environment al degradation engendered by a lack of volatile organic chemicals (VOCs). The method comprises the step of heating the flux solution and dispersing it as a fine spray.
