| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure welding semiconductor device capable of balancing the pressurization stress distribution of the whole pressurization contact surface of a semiconductor chip, by easing the concentration of the pressurization stress in the end of the pressurization contact surface of the semiconductor chip in the pressure welding semiconductor device. SOLUTION: A rigidity reduction means for reducing the rigidity of the edge lower than the rigidity of the center is provided, near the edge of one intermediate pressurizing member, which intervenes between a main electrode and a semiconductor chip. Consequently, the stress concentration in the edge of the medium pressurizing member of the pressurization contact surface of a semiconductor chip is eased, so that balancing of the whole distribution is attained. COPYRIGHT: (C)2005,JPO&NCIPI |
