发明名称 |
Burn-in testing apparatus and method |
摘要 |
An integrated circuit (IC) package testing apparatus integrates a temperature sensor, heater (or cooler), and controller within a single modular unit. The controller is a microprocessor embedded within the modular unit and in communication with the sensor and heater. The controller allows a selected testing temperature to be input by a user via a communications link to the controller. Each IC package has its testing temperature individually controlled by a controller. The module is easily attached and removed from an open-top socket through the use of latches on the testing socket. Many IC packages can be quickly placed and removed from testing sockets when a matrix of sensors and heaters (or coolers) are located on a single top attach plate with the sensors and heaters (or coolers) individually spring-loaded on the single top attach plate.
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申请公布号 |
US2005206368(A1) |
申请公布日期 |
2005.09.22 |
申请号 |
US20050069589 |
申请日期 |
2005.02.28 |
申请人 |
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发明人 |
LOPEZ CHRISTOPHER A.;DENHEYER BRIAN J.;KUENSTER GORDON B. |
分类号 |
G01K1/02;G01K1/16;G01R1/04;G01R31/02;(IPC1-7):G01R31/02 |
主分类号 |
G01K1/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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