<p>A compound represented by the following general formula (1). When incorporated into a rubber, the compound gives a rubber composition which retains processability and high moist-heat adhesiveness and in which the blooming which is observed when resorcinol or an RF resin is contained is minimized. This rubber composition is less apt to decrease in adhesiveness during storage and can stably show its adhesiveness. Also provided is a composition containing the compound as a major ingredient. (1) (In the formula, R represents a C1-16 divalent aliphatic group.)</p>
