发明名称 DOUBLE SHUTTER CONTROL METHOD FOR MULTITARGET SPUTTERING DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a double shutter control method for a multitarget sputtering deposition system capable of preventing the occurrence of crosscontamination between targets due to target substances etc., sticking to shutter plates with a multitarget sputtering deposition system which is equipped with a plurality of the targets within a chamber and is constituted to perform the selection of the target with double rotary shutter mechanisms. SOLUTION: In the multitarget sputtering deposition system equipped with the three targets within the single chamber and the double rotary shutter mechanisms 54 having the independently rotating shutter plates 61 and 62 formed with pores, the shutter control method for the double rotary shutter mechanisms is implemented by a method of depositing films on a substrate by selecting the target from a combination of the pores of the first shutter plate and the second shutter plate, continuing electric discharge to the selected target and performing a pre-sputtering process and a regular sputtering process. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005256112(A) 申请公布日期 2005.09.22
申请号 JP20040070929 申请日期 2004.03.12
申请人 ANELVA CORP 发明人 NOMURA HIDEJI;MIYOSHI AYUMI;MIKI HIROSHI
分类号 C23C14/34;C23C14/32;C23C14/54;C23C14/56;(IPC1-7):C23C14/34 主分类号 C23C14/34
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