| 发明名称 |
Device and method for the application of a sheet-like jointing means onto a contact area of a wafer |
| 摘要 |
The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.
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| 申请公布号 |
US2005199330(A1) |
申请公布日期 |
2005.09.15 |
| 申请号 |
US20050078136 |
申请日期 |
2005.03.11 |
| 申请人 |
THALLNER ERICH |
发明人 |
THALLNER ERICH |
| 分类号 |
H01L21/20;H01L21/30;H01L21/58;(IPC1-7):B32B31/00 |
主分类号 |
H01L21/20 |
| 代理机构 |
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