发明名称 SEMICONDUCTOR LIGHT EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting device wherein light-deriving efficiency from a mold resin to an atmosphere is improved. <P>SOLUTION: The semiconductor light emitting device is provided with a semiconductor light emitting element, the resin to package the semiconductor light emitting element, and a reflection prevention film that is formed on the surface of the resin and made of a a material having an intermediate refraction index between refractive indices of the resin and air. In addition, an irregular surface is formed on at least a part of the surface of the resin, and its average pitch is smaller than a half of the wavelength of light discharging through the resin. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005251875(A) 申请公布日期 2005.09.15
申请号 JP20040058197 申请日期 2004.03.02
申请人 TOSHIBA CORP 发明人 SAKAI TAKAYUKI
分类号 H01L23/29;H01L23/31;H01L29/22;H01L33/44;H01L33/54;H01L33/60;H01L33/62 主分类号 H01L23/29
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