发明名称 Conductive lines embedded in isolation regions
摘要 The circuit has a semi-conductor substrate (101) with an active zone (104) surrounding or surrounded by recesses (125, 126) filled with an insulating material. Conducting regions (140, 141) are centered in the insulating material of the respective recesses, and are connected to a supply or ground conductive line of an interconnection network, and a nearest component e.g. source/drain zone (132) of a transistor, of the circuit. - An INDEPENDENT CLAIM is also included for a method of manufacturing conductive lines laid in an integrated circuit substrate.
申请公布号 EP1569273(A3) 申请公布日期 2005.09.14
申请号 EP20050104911 申请日期 2004.07.29
申请人 ST MICROELECTRONICS S.A. 发明人 SCHOELLKOPF, JEAN-PIERRE;CERUTTI, ROBIN;CORONEL, PHILIPPE;SKOTNICKI, THOMAS
分类号 H01L21/74;H01L21/762;H01L21/765;H01L21/768;H01L21/8244;H01L23/485;H01L23/528;H01L23/535;H01L27/11;H01L29/78;(IPC1-7):H01L21/765 主分类号 H01L21/74
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