| 摘要 |
PROBLEM TO BE SOLVED: To enable packaging density to be enhanced, when forming a plurality of acoustic resonators and acoustic filters on the same board. SOLUTION: The plurality of acoustic resonators are to be formed on the board using a similar method, such as a manufacturing process of integrated circuits etc. First acoustic resonators 22, 24, 26, 28 are formed on the substrate, and second resonators 12a, 14a, 16a are formed by being separated perpendicularly above the first resonators. Spaces between the first and the second acoustic resonators are to be formed, by removing the sacrificial material accumulated during its manufacturing process between one of the first acoustic resonators and one of the second acoustic resonators. COPYRIGHT: (C)2005,JPO&NCIPI |
