| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device capable of dicing each semiconductor element without including foreign matters such as chips or the like, and to provide a semiconductor device. SOLUTION: An oxide film 2 of a sensor element 11 is formed on a rectangular substrate 1, a vibrating plate 3 is formed on the oxide film 2, a fixing part 4 is formed on the vibrating plate 3, and a back electrode 5 is formed on the fixing part 4 so as to face the substrate 1. A gap region 6 is formed between the substrate 1 and the back electrode 5 by the fixing part 4, and a rectangular jettying part 12 is formed so as to position between the sensor element 11 and the side so as to surround the periphery of the back electrode 5 formed on the fixing part 4. The jettying part 12 prevents the foreign matter 104 generated at the time of dicing from entering into the semiconductor element 11. COPYRIGHT: (C)2005,JPO&NCIPI |
