发明名称 Multilayer ceramic electronic part, circuit board and method for producing ceramic green sheet used for manufacturing those part and circuit board
摘要 The present invention provides a method for manufacturing an electronic part that can cope with downsizing, improvement in performance and quality of a multilayer electronic part. A ceramic green sheet is produced by forming on a substrate or on a layer formed on a substrate an internal electrode having a predetermined thickness by a discretional process, forming a photosensitive ceramic slurry on a surface of the substrate or the layer and the internal electrode in such a way that its thickness just before exposure will be substantially equal to or smaller than the thickness of the internal electrode from the surface of the substrate or the layer, irradiating the photosensitive ceramic slurry with light from the upper side of the substrate to perform exposure while masking the internal electrode pattern, to selectively harden the surface of the photosensitive ceramic slurry, the exposure amount being controlled in such a way that the surface of the photosensitive ceramic slurry is hardened, and removing the portion of the photosensitive ceramic slurry that has not been exposed by a development process to expose a surface of the internal electrode pattern.
申请公布号 US2005194084(A1) 申请公布日期 2005.09.08
申请号 US20050068781 申请日期 2005.03.02
申请人 TDK CORPORATION 发明人 YOSHIDA MASAYUKI;AOKI SHUNJI;SUTOH JUNICHI;WATANABE GENICHI
分类号 H01G4/12;C03B29/00;H01F17/00;H01F41/04;H01G4/00;H01G4/30;H05K1/03;H05K1/09;H05K3/00;H05K3/06;H05K3/46;(IPC1-7):C03B29/00 主分类号 H01G4/12
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