发明名称 |
Pressure sensor and manufacturing method of pressure sensor |
摘要 |
A bonding pad for outputting an output of a piezoresistive element to an integrated circuit is disposed on one side of a sensor substrate, and the sensor substrate is adhered to a package at only a rear side of the bonding pad.
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申请公布号 |
US6938492(B2) |
申请公布日期 |
2005.09.06 |
申请号 |
US20030429856 |
申请日期 |
2003.05.06 |
申请人 |
HITACHI LTD. |
发明人 |
TSUKADA MASAO;KUSUYAMA KOICHI |
分类号 |
G01L9/00;G01L19/06;(IPC1-7):G01L9/00 |
主分类号 |
G01L9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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