发明名称 DIAMOND BONDING
摘要 A method of producing a bonded structure which includes a layer of material capable of forming a diffusion or diffusion-type bond with diamond bonded to a diamond element. The method includes the step of applying electron beam heating to a localised region of contacting surfaces between the diamond and the layer of material, or the layer of material and a surface of a metal element or structure to cause bonding of at least some of the contacting surfaces in that region. The method has particular application to the bonding of a layer of diamond to a frame or mount.
申请公布号 WO2005077587(A1) 申请公布日期 2005.08.25
申请号 WO2005IB00045 申请日期 2005.01.12
申请人 ELEMENT SIX LIMITED;WHITEHEAD, ANDREW, JOHN;VAN OERLE, BARTHOLOMEUS, MATHIAS;WORT, CHRISTOPHER, JOHN, HOWARD;SCHAICH, THOMAS, JOSEF;DONALD, HEATHER, JUNE 发明人 WHITEHEAD, ANDREW, JOHN;VAN OERLE, BARTHOLOMEUS, MATHIAS;WORT, CHRISTOPHER, JOHN, HOWARD;SCHAICH, THOMAS, JOSEF
分类号 B23K1/005;B23K15/00;C04B37/02 主分类号 B23K1/005
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