发明名称 Cooling unit for electronic components includes fan-like heat sink thermally- and mechanically connected to rotating body in cooling structure containing good thermal conductor
摘要 <p>The rotary heat sink (18) producing a cooling airflow, is rigidly connected to a shaft (16) rotated in the cooling structure. The cooling structure container (10) is filled with a good thermal conductor (14). The shaft extends into the container It is rigidly connected to a rotary body (15).</p>
申请公布号 DE102004009500(B3) 申请公布日期 2005.08.25
申请号 DE20041009500 申请日期 2004.02.27
申请人 MINEBEA CO., LTD. 发明人 BREIER, ANTON;KAMAGATA, HIDETOSHI
分类号 F28F13/12;H01L23/467;H01L23/473;(IPC1-7):H05K7/20;F28D11/00;G01F1/20;H01L23/34;F28F5/00 主分类号 F28F13/12
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