发明名称 |
Cooling unit for electronic components includes fan-like heat sink thermally- and mechanically connected to rotating body in cooling structure containing good thermal conductor |
摘要 |
<p>The rotary heat sink (18) producing a cooling airflow, is rigidly connected to a shaft (16) rotated in the cooling structure. The cooling structure container (10) is filled with a good thermal conductor (14). The shaft extends into the container It is rigidly connected to a rotary body (15).</p> |
申请公布号 |
DE102004009500(B3) |
申请公布日期 |
2005.08.25 |
申请号 |
DE20041009500 |
申请日期 |
2004.02.27 |
申请人 |
MINEBEA CO., LTD. |
发明人 |
BREIER, ANTON;KAMAGATA, HIDETOSHI |
分类号 |
F28F13/12;H01L23/467;H01L23/473;(IPC1-7):H05K7/20;F28D11/00;G01F1/20;H01L23/34;F28F5/00 |
主分类号 |
F28F13/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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