| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To establish a process for forming a deterioration layer in a wafer along a predetermined division line, using a pulse laser beam, dividing the wafer into individual chips along the deteriorated layer and picking up the divided chips. <P>SOLUTION: The method for dividing a wafer, arranged with a functional element in a region sectioned by predetermined division lines, along the predetermined division lines comprises a step for sticking the wafer to a dicing tape, a step of polishing the rear surface of the wafer, a step for forming a deteriorated layer in the wafer along the predetermined division line by irradiating the wafer with a pulse laser beam transmitting the wafer from the rear surface side along the predetermined division line, a step of dividing the wafer into individual chips along the predetermined division line by imparting an external force, a step of enlarging the interval between the chips by spreading the dicing tape, and a step of picking up each chip. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
