发明名称 ELECTRONIC COMPONENT, ITS MANUFACTURING PROCESS AND ELECTRONIC APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To obtain an electronic component which can be mounted by a simple and inexpensive means without using a mounter. <P>SOLUTION: The inventive electronic component, i.e. a semiconductor device 1, comprises a functional section 3 formed on the surface 2a of a silicon substrate 2 and performing a predetermined function, and external electrodes 6<SB>1</SB>-6<SB>20</SB>and 7<SB>1</SB>-7<SB>20</SB>for connecting the input terminals 4<SB>1</SB>-4<SB>3</SB>and the output terminals 5<SB>1</SB>-5<SB>3</SB>of the functional section 3 with the outside. The external electrodes 6<SB>1</SB>-6<SB>20</SB>and 7<SB>1</SB>-7<SB>20</SB>are arranged on the surface 2a and the bottom face 2b of the silicon substrate 2 so that the semiconductor device 1 can be mounted either on the surface or the rear surface and connected with a corresponding input terminal 4 or output terminal 5. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005223311(A) 申请公布日期 2005.08.18
申请号 JP20040330289 申请日期 2004.11.15
申请人 SEIKO EPSON CORP 发明人 HASHIMOTO NOBUAKI
分类号 H01L23/52;H01G4/228;H01L21/3205;H01L21/60;H01L21/77;H01L21/822;H01L23/12;H01L23/31;H01L23/48;H01L23/485;H01L25/065;H01L25/07;H01L25/10;H01L25/18;H01L27/04 主分类号 H01L23/52
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