发明名称 |
METHOD FOR MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic electronic component comprising steps for supplying a mother ceramic green sheet supported by a carrier film, and highly accurately laminating the mother ceramic green sheet using transfer/press technologies so as to obtain a laminated body. SOLUTION: The method for manufacturing the laminated ceramic electronic component comprises steps of: pressing a mother ceramic green sheet 1 supported by a carrier film 2 from the side of the mother ceramic green sheet 1 onto an outer peripheral surface of a first holding roll 7; releasing the carrier film 2; and then laminating only the mother ceramic green sheet 1 that is held by the holding roll 7 on the outer peripheral surface of a laminating roll 11 as a laminating stage. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005217278(A) |
申请公布日期 |
2005.08.11 |
申请号 |
JP20040023685 |
申请日期 |
2004.01.30 |
申请人 |
MURATA MFG CO LTD |
发明人 |
TAKASHIMA HIROYOSHI;YUKIKAWA SHINICHI |
分类号 |
B28B11/00;H01G4/12;H01G4/30;H01G13/00;(IPC1-7):H01G4/12 |
主分类号 |
B28B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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