| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of saving a formation of an inter-chip connection electrode having a complex step in a three dimensional integration and requiring no accurate inter-chip positioning owing to a wireless connection, capable of suppressing a transmission power by using a resonance characteristic to realize a lowered power consumption of a communication circuit, further capable of decreasing an area of a plane inductor to realize a multichannel, and capable of easily radiating heat of an internal chip by widening a chip interval. <P>SOLUTION: The wireless signal transfer for wiring connection between chips is realized by the electromagnetic coupling between plane inductors formed on a laminated IC chips instead of an electrode for the connection between chips. The resonance circuit is realized on the IC chip by forming a capacity together with the plane inductor. The digital transmission producing no bit error at high speed in the wireless communication between chips is realized by equalizing the transmission frequency to the resonance frequency, and by further suppressing an unnecessary residual vibration causing an intersymbol interference. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
