发明名称 Multi stage mounting printed circuit board system and method
摘要 A multi stage mounting printed circuit board system and method is presented. In one embodiment, a multi stage mounting printed circuit board system includes a first printed circuit board for mounting electrical components on. A first printed circuit board interface component is coupled to the first printed circuit board. The first printed circuit board interface component communicatively couples the first printed board to a second printed board via a second printed circuit board interface component. A plurality of printed circuit board extractors are coupled to the first printed circuit board. The plurality of printed circuit board extractors couple the first printed circuit board to card guides (e.g., a single pair of card guides in which the second printed circuit board is mounted).
申请公布号 US2005157481(A1) 申请公布日期 2005.07.21
申请号 US20040758982 申请日期 2004.01.16
申请人 BARSUN STEPHAN KARL;DOBBS ROBERT WILLIAM 发明人 BARSUN STEPHAN KARL;DOBBS ROBERT WILLIAM
分类号 H05K7/02;H05K7/04;H05K7/14;(IPC1-7):H05K7/02 主分类号 H05K7/02
代理机构 代理人
主权项
地址