发明名称 PRINTED CIRCUIT BOARD INCLUDING PASSIVE ELEMENTS AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board comprising passive elements in the structure that moisture absorption of passive elements can be prevented, change in the capacitance value of passive elements resulting from moisture absorption can be controlled, and moisture absorbed by the comprised passive elements can be removed easily; and also to provide a method of manufacturing the same printed circuit board. <P>SOLUTION: The printed circuit board comprises passive elements which includes a single layer or more layers of insulating layer and wiring layer and comprises any one or more passive elements among the capacitor, a resistance element, and an inductor in at least one layer of insulating layers, the insulating layer comprising passive elements is formed of a porous insulating material. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005197427(A) 申请公布日期 2005.07.21
申请号 JP20040001708 申请日期 2004.01.07
申请人 TOPPAN PRINTING CO LTD 发明人 ENDO MITSUTERU
分类号 H05K1/16;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/16
代理机构 代理人
主权项
地址