发明名称 CURABLE COMPOSITION FOR SEALING MATERIAL
摘要 PROBLEM TO BE SOLVED: To obtain a curable composition for sealing materials excellent in low moisture permeability, having good adhesiveness, workability, heat resistance and weather resistance and adequate rubber elasticity. SOLUTION: This curable composition for sealing materials comprises (A) a polyorganosiloxane having two or more alkenyl groups bonded to silicon atoms in one molecule, (B) a polyisobutylene having two or more alkenyl groups in one molecule, (C) a polyorganohydrodienesiloxane having two or more hydrogen atoms bonded to silicon atoms in one molecule, (D) an organosilicon compound having hydrogen atoms bonded to silicon atoms and a group represented by formula (1) (wherein Q<SP>1</SP>and Q<SP>2</SP>are each a divalent hydrocarbon group; R<SP>1</SP>and R<SP>2</SP>are each a monovalent 1-4C hydrocarbon group; (a) is 0 or 1) in one molecule and/or an organosilicon compound represented by formula (2) (wherein Q<SP>3</SP>is a divalent hydrocarbon group; R<SP>3</SP>and R<SP>4</SP>are each a monovalent 1-4C hydrocarbon group; X is a group selected from an acrylic group, a methacrylic group, a glycidoxy group and an epoxycyclohexyl group; (b) is 0 or 1), (E) an inorganic filler and (F) a platinum-based catalyst. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005194420(A) 申请公布日期 2005.07.21
申请号 JP20040003127 申请日期 2004.01.08
申请人 GE TOSHIBA SILICONES CO LTD 发明人 FUJIMOTO TETSUO
分类号 C08L83/07;C08K3/00;C08K3/08;C08K5/5419;C08L23/26;C08L83/05;(IPC1-7):C08L83/07;C08K5/541 主分类号 C08L83/07
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