| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device for improving packaging precision, a method for manufacturing the semiconductor device, a circuit board, and electronic equipment. <P>SOLUTION: The semiconductor device comprises a substrate 10 in which a plurality of leads are formed, a semiconductor chip 100 that is mounted on the substrate 10 while a plurality of electrodes 24 and leads are electrically connected opposingly, and an insulating film 18 positioned in a region overlapping with the semiconductor chip 100 on the substrate 10. The insulating film 18 includes first and second portions 42, 44. The first portion 42 is positioned so that it opposes a first side 62 facing the first direction of either electrode 24. The second portion 44 is positioned so that it opposes a second side 64 facing the second direction crossing the first direction of either electrode 24. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
