发明名称 Capacitor, circuit board with built-in capacitor and method of manufacturing the same
摘要 In a capacitor 10, a first electrode 21, a dielectric layer 23, a solid electrolytic layer 50 and a second electrode 31 are provided. In a manufacturing process, the dielectric layer 23 and a first solid electrolytic layer 24 formed by a chemical polymerization film are provided on the first electrode 21 side, while a second solid electrolytic layer 32 formed by an electrolytic polymerization film is provided on the second electrode 31 side. Then, the solid electrolytic layers are bonded to each other.
申请公布号 US2005152097(A1) 申请公布日期 2005.07.14
申请号 US20050031764 申请日期 2005.01.07
申请人 SHINKO ELECTRIC INDUSTRIES, CO., LTD. 发明人 SAKAGUCHI HIDEAKI;HIGASHI MITSUTOSHI;MOCHIZUKI TAKASHI
分类号 H01G9/028;H01G9/00;H01G9/02;H05K1/16;H05K3/46;(IPC1-7):H01G9/00 主分类号 H01G9/028
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