发明名称 |
Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
摘要 |
In a capacitor 10, a first electrode 21, a dielectric layer 23, a solid electrolytic layer 50 and a second electrode 31 are provided. In a manufacturing process, the dielectric layer 23 and a first solid electrolytic layer 24 formed by a chemical polymerization film are provided on the first electrode 21 side, while a second solid electrolytic layer 32 formed by an electrolytic polymerization film is provided on the second electrode 31 side. Then, the solid electrolytic layers are bonded to each other.
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申请公布号 |
US2005152097(A1) |
申请公布日期 |
2005.07.14 |
申请号 |
US20050031764 |
申请日期 |
2005.01.07 |
申请人 |
SHINKO ELECTRIC INDUSTRIES, CO., LTD. |
发明人 |
SAKAGUCHI HIDEAKI;HIGASHI MITSUTOSHI;MOCHIZUKI TAKASHI |
分类号 |
H01G9/028;H01G9/00;H01G9/02;H05K1/16;H05K3/46;(IPC1-7):H01G9/00 |
主分类号 |
H01G9/028 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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