发明名称 THIN FILM BULK WAVE SOUND RESONATOR AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a thin film bulk wave sound resonator capable of restraining degradation of a high-frequency characteristic. <P>SOLUTION: The thin film bulk wave sound resonator is equipped with a second insulating layer pattern 2 arranged separately from a first insulating layer pattern 1, a third insulating layer pattern 3 arranged separately from the first insulating layer pattern 1 on an opposite side of the second insulating layer pattern, and a fourth insulating layer pattern 4 arranged on the opposite side of the first insulating layer pattern separately from the second insulating layer pattern, an underneath conductive layer 40 ranging from an inside of a region surrounded by the first and second insulating patterns to an upside of the third insulating layer pattern via the first insulating layer pattern, a piezoelectric film 42 each of whose opposed outer edges is arranged on the first and second insulating layer patterns and which is arranged on a surface of the underneath conductive layer, and an upside conductive layer 48 which is opposed to the underneath conductive layer in a manner of sandwiching the piezoelectric film 42 and ranges further to an upside of the fourth insulating layer pattern via the second insulating layer pattern. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005191958(A) 申请公布日期 2005.07.14
申请号 JP20030431235 申请日期 2003.12.25
申请人 TOSHIBA CORP 发明人 EBUCHI YASUO;SANO KENYA;MOTAI TAKAKO
分类号 H01L41/09;H01L21/20;H01L21/302;H01L21/36;H01L21/461;H01L41/08;H01L41/18;H01L41/187;H01L41/22;H03H3/02;H03H9/02;H03H9/17;H03H9/58 主分类号 H01L41/09
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